Failure Analysis Process

The Gestlabs laboratory offers the Failure Analysis service on printed boards, components and finished products.

It uses X-Ray analysis, C-SAM and metallographic microsections for the constructive analysis of components such as MLCC, resistances and active components; datasheet electrical tests for the characterisation of passive components such as resistances, capacities, inductances and wirings, and of discrete active components such as diodes, MOSFETs, IGBTs and transistors. It is also able to perform decapsulation for the superficial analysis of dies and wire bonding.

For the Failure Analysis of PCB and PCBA, the Gestlabs lab can make dimensional checks of conductors and of superficial insulation of printed boards; it can check the metallization and the stack-up through metallographic microsections and/or SEM-EDX electron microscopy analysis. Furthermore, it can check compliance with IPC standards through X-Ray analysis and optical analysis.

Among the analytic techniques used in the failure analysis process, the Gestlabs laboratory can use techniques such as FT-IR (Fourier Transform InfraRed Spectroscopy) analysis for organic-compound research, electrical checks (voltage, continuity), Dye & Pry, and SEM-EDX electron microscopy analysis.

In the defectiveness analysis of the product, we can define the Failure Analysis path, perform the analysis of the stress condition of components due to the design, and measure and perform the electrical characterisation at full capacity and during transients.

We can perform the Failure Analysis of active and passive components, produce the infra-red heat map with measurements on components in the thermal camera, simulate failures, and define possible solutions.