Among the main tests we can perform in our laboratories to evaluate and validate new processes and technologies are the following.
Main tests
HTS (High Temperature Storage)
The aim of this ageing test is to characterise the quality of intermetallic growth. It is a long-duration, high-temperature test: 1000 hours at 125°C.
Technical regulations: IEC 60068 (Environmental Test Procedures)
S.I.R. (Surface Insulation Resistance)
This test method is used to quantify the damaging effects of manufacturing and handling processes or residues on surface insulation resistance in the presence of humidity. The electrodes — electronically polarised during conditioning to ease electro-chemical reactions — are placed on parallel traces on a printed circuit or a standard assembled sheet. The samples are conditioned and the measurements are taken at a high level of humidity.
Test method: IPC TM-650 2.6.3.7 (Surface Insulation Resistance)
ATC (Accelerated Thermal Cycling)
The aim of this test is to evaluate the stress to which the soldering is subjected according to temperature variation. The ATC involves a slow temperature variation, not more than 20°C per minute. The thermal cycle provokes different thermal expansion/contraction according to the material composition, creating mechanical stresses that include plastic deformations and accelerate the life cycle of the material — for example causing micro-fractures inside the soldering that, after several cycles, can lead to a total breakout.
Technical regulations: IEC 60068 (Environmental Test Procedures)
T&H (Temperature and Humidity)
The aim of this test is to evaluate the impact of chemical substances on PCBA (for example flux residues). It is performed according to the JEDEC JESD22-100C standard, respecting the following parameters: a duration of 240 hours, a temperature of 85°C and 85% humidity. The result of the functional test is considered positive if there is no dendritic growth.
Technical regulations: IEC 60068 (Environmental Test Procedures)
Thermal Shock
Thermal shocks differ from thermal cycles because of the rapid temperature change, and for this reason they provoke different failure mechanisms. During thermal shocks, materials are subjected to deformation phenomena; on the PCBA they cause the deformation of the PCB or of assembled components, creating a deformation perpendicular to the sheet surface.
Technical regulations: IEC 60068 (Environmental Test Procedures)
Available equipment
ANGELANTONI mod. CTS 157/2T
- Type
- Double chamber
- Test
- Thermal Cycle Chamber, Thermal Shock Test
- Quantity
- 2
- Features
- -60°C / +200°C
- Standard profiles
- -55°C / +125°C
- Ramp rate
- Immediate transition
- Size (L×H×P)
- 530 x 450 x 660 mm
VOTSCH mod. VC7012 S2
- Type
- Double chamber
- Test
- Thermal Cycle Chamber, Thermal Shock Test
- Quantity
- 1
- Features
- -80°C / +200°C
- Standard profiles
- -55°C / +125°C
- Ramp rate
- Immediate transition
- Size (L×H×P)
- 470 x 650 x 410 mm
ANGELANTONI CLIMATIC SYSTEM mod. TY150C/SP
- Type
- Single chamber
- Test
- Thermal Cycle Chamber, Temperature Cycling Test
- Quantity
- 1
- Features
- -30°C / +150°C
- Standard profiles
- 0°C / +100°C
- Ramp rate
- 10°C / min
- Size (L×H×P)
- 580 x 320 x 450 mm
WEISS mod. WT1-480/70/15
- Type
- Single chamber
- Test
- Thermal Cycle Chamber, Temperature Cycling Test
- Quantity
- 1
- Features
- -70°C / +180°C
- Standard profiles
- -40°C / +100°C; -55°C / +125°C
- Ramp rate
- 12°C / min
- Size (L×H×P)
- 800 x 1000 x 600 mm
SECASI mod. VRT50 C200 F50/3
- Type
- Single chamber
- Test
- Thermal Cycle Chamber, Temperature Cycling Test
- Quantity
- 2
- Features
- -30°C / +200°C
- Standard profiles
- 0°C / +100°C; 0°C / +125°C
- Ramp rate
- max 8°C / min
- Size (L×H×P)
- 340 x 340 x 435 mm
SECASI mod. VRT50 C200 F70/5
- Type
- Single chamber
- Test
- Thermal Cycle Chamber, Temperature Cycling Test
- Quantity
- 1
- Features
- -70°C / +200°C
- Standard profiles
- -40°C / +65°C; -10°C / +150°C
- Ramp rate
- 10°C / min
- Size (L×H×P)
- 340 x 340 x 435 mm
MAZZALI mod. Tesys 630H
- Type
- Single chamber
- Test
- Thermal Cycle Chamber, Temperature Cycling Test
- Quantity
- 1
- Features
- -70°C / +180°C
- Standard profiles
- -40°C / +100°C; -55°C / +125°C
- Ramp rate
- 7°C / min
- Size (L×H×P)
- 700 x 1000 x 700 mm
VOTSCH mod. VC4057
- Type
- Climatic Chamber
- Test
- Temperature, Humidity, Bias SOAK
- Quantity
- 3
- Features
- -40°C / +150°C, 10/98% RH
- Standard profiles
- +85°C / 85% RH; +30°C / 60% RH
- Size (L×H×P)
- 575 x 645 x 550 mm
VOTSCH mod. VC7018
- Type
- Climatic Chamber
- Test
- Temperature, Humidity, Bias SOAK
- Quantity
- 1
- Features
- -75°C / +180°C, 10/98% RH
- Standard profiles
- +85°C / 85% RH; +30°C / 60% RH
- Size (L×H×P)
- 580 x 750 x 450 mm
ANGELANTONI CLIMATIC SYSTEM mod. HYGROS 600
- Type
- Climatic Chamber
- Test
- Temperature, Humidity, Bias SOAK
- Quantity
- 2
- Features
- -40°C / +180°C, 10/98% RH
- Standard profiles
- +85°C / 85% RH; +30°C / 60% RH
- Size (L×H×P)
- 820 x 700 x 700 mm
A.C.S. mod. CHALLENGE 250-TC
- Type
- Single chamber
- Test
- Thermal Cycle Chamber, Temperature Cycling Test
- Quantity
- 2
- Features
- -55°C / +180°C
- Standard profiles
- -40°C / +100°C; -55°C / +125°C
- Ramp rate
- 3°C / min
- Size (L×H×P)
- 520 x 700 x 520 mm
MAZZALI mod. Thermair 700
- Type
- Thermal Oven
- Test
- Cure & Bake
- Quantity
- 1
- Features
- +150°C
- Standard profiles
- +40°C / +250°C
- Size (L×H×P)
- 430 x 430 x 480 mm
BIOBLOCK
- Type
- Thermal Oven
- Test
- Cure & Bake
- Quantity
- 1
- Features
- +125°C
- Standard profiles
- +40°C / +200°C
- Size (L×H×P)
- 430 x 450 x 460 mm